Silane derivatives which improve properties of PPE-polyamide compositions

ABSTRACT

Novel polyphenylene ether-polyamide compositions having improved compatibility, elongation and impact properties as well as improved processability are prepared comprising one or more polyphenylene ethers, one or more polyamides and a property improving silane derivative compound having in the molecule both (a) at least one silicon bonded to a carbon through an oxygen link and (b) at least one ethylenic carbon-carbon double bond or carbon-carbon triple bond and/or functional group selected from the group consisting of an amine group or a mercapto group, with the proviso that the functional group is not directly bonded to a silicon atom. These compositions may further comprise a polymeric impact modifier therefore and/or an inorganic reinforcing additive and/or other polymers including alkenyl aromatic polymers.

This is a continuation of application Ser. No. 140,959 filed on12/31/87; abandoned which is a continuation of application Ser. No.888,624 filed on 07/21/86, abandoned; which is a continuation ofapplication Ser. No. 669,130 filed on 11/07/84, abandoned.

The present invention relates to resin compositions comprising one ormore polyphenylene ethers, one or more polyamides and a propertyimproving compound having in the molecule both (a) at least one siliconbonded to carbon through an oxygen link and (b) at least one ethyleniccarbon-carbon double bond or carbon-carbon triple bond and/or functionalgroup selected from the group consisting of an amine group or a mercaptogroup, with the proviso that the functional group is not directly bondedto a silicon atom. The compositions of the present invention are foundto have superior impact strength and tensile elongation, as well asbetter overall properties, as compared to unmodified polyphenyleneether-polyamide compositions.

The polyphenylene ether resins are characterized by a unique combinationof chemical, physical and electrical properties over a temperature rangeof more than 600° F., extending from a brittle point of about -275° F.to a heat distortion temperature of about 375° F. This combination ofproperties renders the polyphenylene ethers suitable for a broad rangeof applications. However, in spite of the aforementioned beneficialproperties, the usefulness of the polyphenylene ether resins is limitedas a consequence of their poor processability, impact resistance andchemical resistance.

Finholt (U.S. Pat. No. 3,379,792) discloses polymer blends wherein theprocessability of polyphenylene ether resins may be improved by blendingtherewith from 0.1 to 25% by weight of a polyamide. However, theadvantages of the Finholt invention are limited by the fact that whenthe concentration of the polyamide exceeds 20% by weight, appreciablelosses in other physical properties result. Specifically, there is no,or at best poor, compatibility between the polyphenylene ether and thepolyamide such that phase separation of the resins occurs on molding orthe molded article is inferior in mechanical properties.

Ueno et al (U.S. Pat. No. 4,315,086) discloses polyphenylene etherblends having improved chemical resistance without a loss of othermechanical properties by blending therewith a polyamide and a specificcompound selected from the group consisting essentially of A) liquiddiene polymers, B) epoxy compounds and C) compounds having in themolecule both of i) an ethylenic carbon-carbon double bond orcarbon-carbon triple bond and ii) a carboxylic acid, acid anhydride,acid amide, imide, carboxylic acid ester, amino or hydroxyl group.

Finally, Kasahara et al (EP46040) discloses the use of a copolymercomprising units of a vinyl aromatic compound and either an alpha,beta-unsaturated dicarboxylic acid anhydride or an imide compoundthereof as a modifier to an impact resistant polyphenyleneether-polyamide blend for improved heat resistance and oil resistance.

Applicants have now discovered novel polyphenylene ether-polyamidecompositions having superior impact strength and tensile elongation aswell as excellent general physical properties including strength,chemical resistance, processability and/or heat resistance as comparedto unmodified polyphenylene ether-polyamide compositions. Additionally,these compositions have greatly reduced water absorption as compared topolyamide alone. Specifically, applicants have discovered novel resincompositions having the aforementioned properties comprising one or morepolyphenylene ethers, one or more polyamides and a property improvingcompound having in the molecule both (a) at least one silicon atombonded to a carbon atom through an oxygen link and (b) at least oneethylenic carbon-carbon double bond or carbon-carbon triple bond and/orat least one functional group selected from the group consisting of anamino group or a mercapto group or both, with the proviso that neitherthe amine group nor the mecapto group is directly bonded to a siliconatom. Optionally, the compositions of the present invention may furthercomprise a polymeric impact modifier therefore and/or an inorganicreinforcing additive and/or other polymers including alkenyl aromaticpolymers such as the styrenic polymers.

The improved polyphenylene ether-polyamide compositions of applicants'invention may be made by melt blending the above-mentioned ingredients.Alternatively, it may be preferred to achieve optimum propertyimprovements to premix the property improving compound, together witheither one of the polymer resins, most preferably the polyphenyleneether, and subsequently add the second polymer resin.

Although the exact physical configuration of the compositions of thepresent invention is not known, it is generally believed that thecompositions comprise a dispersion of one polymer in the other.Applicants believe the likely configuration is wherein the polyphenyleneether is dispersed in a polyamide matrix, however, the inverse may alsobe possible particularly where the polyamide is present in only a minoramount. Applicants also contemplate that there may be present in theproducts produced hereby some graft polyphenylene ether-polyamideproducts wherein the silane derivative compound may serve as a graftlinking agent. Thus, all such dispersions as well as graft, partiallygrafted and non-grafted products are within the full intended scope ofthe present invention.

The polyphenylene ethers suitable for use in the practice of the presentinvention are well known in the art and may be prepared by any of anumber of catalytic and non-catalytic processes from correspondingphenols or reactive derivatives thereof. Examples of polyphenyleneethers and methods for their production are disclosed in U.S. Pat. Nos.3,306,874; 3,306,875; 3,257,357; 3,257,358; 3,337,501 and 3,787,361, allincorporated herein by reference. For brevity, the term "polyphenyleneether" as used throughout this specification and the appended claimswill include not only unsubstituted polyphenylene ether (made fromphenol) but also polyphenylene ethers substituted with varioussubstituents. The term also includes polyphenylene ether copolymers,graft copolymers and block copolymers of alkenyl aromatic compounds,especially vinyl aromatic compounds, as disclosed below, and apolyphenylene ether.

Suitable phenol compounds for the preparation of the polyphenyleneethers may be represented by the general formula: ##STR1## wherein eachQ is a monovalent substituent individually selected from the groupconsisting of hydrogen, halogen, aliphatic and aromatic hydrocarbon andhydrocarbonoxy radicals free of a tertiary alpha-carbon atom andhalohydrocarbon and halohydrocarbonoxy radicals free of a tertiaryalpha-carbon atom and having at least two carbon atoms between thehalogen atom and the phenyl nucleus, and wherein at least one Q ishydrogen.

As specific examples of the phenol compound represented by the aboveformula, there may be given phenol; o-, m- and p- cresols; 2,6-, 2,5-,2,4- and 3,5- dimethylphenols; 2-methyl-6-phenyl-phenol;2,6-diphenylphenol; 2,6-diethylphenol; 2-methyl-6-ethylphenol; and2,3,5-, 2,3,6- and 2,4,6-trimethylphenols. Two or more phenol compoundsmay be used in combination should copolymers be desired. Additionally,copolyphenylene ethers may also be prepared from a phenol compound ofthe above general formula with a phenol compound not represented by theabove general formula including, for example, a dihydric phenol such asbisphenol-A, tetrabromobisphenol-A, resorcinol or hydroquinone.

Illustrative of suitable polyphenylene ethers there may be given, forexample, poly(2,6 dimethyl-1,4-phenylene)ether;poly(2-methyl-1,4-phenylene)-ether, poly(3-methyl-1,4-phenylene)ether;poly(2,6-diethyl-1,4-phenylene)ether;poly(2-methyl-6-allyl-1,4-phenylene)ether;poly(2,6-dichloromethyl-1,4-phenylene)ether;poly(2,3,6-trimethyl-1,4-phenylene) ether; poly(2,3,5,6-tetramethylphenylene)ether; poly (2,6-dichloro-1,4-phenylene)ether;poly(2,6-diphenyl-1,4-phenylene)ether;poly(2,5-dimethyl-1,4-phenylene)-ether and the like. Further, asmentioned above, copolymers of the phenol compounds may also be used.

Preferred polyphenylene ethers will have the formula: ##STR2## where Qis as defined above and n is at least 50, preferably from about 50 toabout 200. Examples of polyphenylene ethers corresponding to the aboveformula can be found in the above referenced patents and include, amongothers: poly(2,6-dilauryl-1,4-phenylene)ether;poly(2,6-diphenyl-1,4-phenylene)-ether;poly(2,6-dimethoxy-1,4-phenylene)ether; poly-(2,6-diethoxy-1,4-phenylene)ether; poly (2-methoxy-6-ethoxy-phenylene)ether;poly(2-ethyl-6-stearyloxy-1,4-phenylene)ether;poly(2,6-dichloro-1,4-phenylene)ether;poly(2-methyl-6-phenyl-1,4-phenylene)ether poly(2,6-dibenzyl-1,4-phenylene)ether; poly(2-ethoxy-1,4-phenylene)ether;poly(2-chloro-1,4-phenylene)ether; poly(2,6-dibromo-1,4-phenylene)ether;and the like.

For the purpose of the present invention, an especially preferred familyof polyphenylene ethers include those having a C₁ to C₄ alkylsubstitution in the two positions ortho to the oxygen ether atom.Illustrative member of this class are:poly(2,6-dimethyl-1,4-phenylene)ether;poly(2,6-diethyl-1,4-phenylene)ether;poly(2-methyl-6-ethyl-1,4-phenylene)ether;poly(2,6-dipropyl-1,4-phenylene)ether; poly(2-ethyl-6-propyl-1,4-phenylene)ether; and the like; most preferablypoly(2,6-dimethyl-1,4-phenylene)ether.

One method for the production of the above polyphenylene ethers is bythe oxidation of a phenol compound by oxygen or an oxygen-containing gasin the presence of a catalyst for oxidative coupling. There is noparticular limitation as to the choice of catalysts and any catalystsfor oxidation polymerization can be employed. As typical examples of thecatalyst, there may be given a catalyst comprising a cuprous salt and atertiary amine and/or secondary amine, such as cuprouschloride-trimethylamine and dibutylamine, cuprous acetate-triethylamineor cuprous chloridepyridine; a catalyst comprising a cupric salt, atertiary amine, and an alkali metal hydroxide, such as cupricchloride-pyridine-potassium hydroxide; a catalyst comprising a manganesesalt and a primary amine, such as manganese chloride-ethanolamine ormanganese acetate-ethylenediamine; a catalyst comprising a manganesesalt and an alcoholate or phenolate, such as manganese chloride-sodiummethylate or manganese chloride-sodium phenolate; and a catalystcomprising a cobalt salt and a tertiary amine.

Polyamides suitable for the preparation of the compositions of thepresent invention may be obtained by polymerizing amonoamino-monocarboxylic acid or a lactam thereof having at least 2carbon atoms between the amino and carboxylic acid group; or bypolymerizing substantially equimolar proportions of a diamine whichcontains at least 2 carbon atoms between the amino groups and adicarboxylic acid; or by polymerizing a monoaminocarboxylic acid or alactam thereof as defined above together with substantiallyequimolecular proportions of a diamine and a dicarboxylic acid. Thedicarboxylic acid may be used in the form of a functional derivativethereof, for example an ester or acid chloride.

The term "substantially equimolecular" proportions (of the diamine andof the dicarboxylic acid) is used to cover both strict equimolecularproportions and slight departures therefrom which are involved inconventional techniques for stabilizing the viscosity of the resultantpolyamides.

Examples of the aforementioned monoamino-monocarboxylic acids or lactamsthereof which are useful in preparing the polyamides include thosecompounds containing from 2 to 16 carbon atoms between the amino andcarboxylic acid groups, said carbon atoms forming a ring with the--CO--NH-- group in the case of a lactam. As particular examples ofaminocarboxylic acids and lactams there may be mentioned ε-aminocaproicacid, butyrolactam, pivalolactam, caprolactam, capryllactam,enantholactam, undecanolactam, dodecanolactam and 3- and 4- aminobenzoicacids.

Examples of diamines suitable for preparing the polyamides includediamines of the general formula

    H.sub.2 N(X).sub.n NH.sub.2

wherein X is a C₂ -C₁₆ branched or non-branched aliphatic and/orcycloaliphatic hydrocarbon radical or a C₆ -C₁₆ aromatic hydrocarbonradical, such as trimethylenediamine, tetramethylenediamine,pentamethylenediamine, octamethylenediamine benzenediamine, 2,2,4- or2,4,4-trimethyl hexamethylenediamine and especiallyhexamethylenediamine.

The dicarboxylic acids may be aromatic, for example isophthalic andterephthalic acids. Preferred dicarboxylic acids are of the formula

    HOOC--Y--COOH

wherein Y represents a divalent aliphatic group containing at least 2carbon atoms, and examples of such acids are sebacic acid,octadecanedoic acid, suberic acid, glutaric acid, pimelic acid andadipic acid.

Typical examples of the polyamides or nylons, as these are often called,include for example polyamides 6, 4/6, 6/6, 11, 12, 6/3, 6/4, 6/10 and6/12 as well as polyamides resulting from isophthalic acid orterephthalic acid or mixtures thereof and hexamethylenediamine ortrimethyl hexamethylene diamine (for example polyamides 6/I, 6/T and6/I/T), polyamides resulting from adipic acid and meta xylylenediamines,polyamides resulting from adipic acid, azelaic acid and2,2-bis-(p-aminocyclohexyl)propane and polyamides resulting fromterephthalic acid and 4,4'-diaminodicyclohexylmethane. Preferredpolyamides are the polyamides 6, 4/6, 6/I, 6/6, 11 and 12, mostpreferably polyamide 6, 6/6 and 4/6. When used herein and in theappended claims, the term "polyamide" is to be construed as includingpolyamide copolymers as well as mixtures of homopolymers and/orcopolymers.

The blending ratio of polyphenylene ether to polyamide is 5 to 95% bywt. preferably 30 to 70% by wt. of the former to 95 to 5% by wt.,preferably 70 to 30% by wt. of the latter. When the polyamide is lessthan 5 wt.%, its effect to improve solvent resistance is small, whilewhen it exceeds 95 wt.%, thermal properties and dimensional stabilitytend to become poor.

The property improving compounds suitable for use in the presentinvention are silane derivatives characterized as having in theirmolecule both (a) at least one silicon bonded to carbon through anoxygen link and (b) at least one ethylenic carbon-carbon double bond ora carbon-carbon triple bond and/or a functional group selected from thegroup consisting of an amino group or a mercapto group or both, with theproviso that neither the mercapto nor the amino group is directly bondedto a silicon atom.

As mentioned, the silane derivative compounds must have as one criticalfeature at least one silicon bonded to carbon through an oxygen linkage.Most commonly, this feature is brought about by an alkoxy or acetoxygroup being directly bonded to the silicon, wherein the alkoxy oracetoxy group will generally have less than about 15 carbon atoms andmay also contain hetero atoms in the chain, e.g. oxygen. Additionally,there may be present more than one silicon atom wherein any two or moresilicon atoms may be bonded to each other through an oxygen link, e.g.siloxanes; a silicon-silicon bond; or a bifunctional organic group, e.g.methylene or phenylene groups. Again, at least one and preferably allsilicons will have at least one silicon bonded to carbon through anoxygen link. Preferred compounds will have one silicon atom with threealkoxy or acetoxy groups bonded thereto. Silicon compounds having morethan one silicon atom will preferably have the silicon atoms bonded toeach other through an oxygen atom (i.e., siloxane).

The second critical feature of the silane derivative modifier is thepresence in the molecule of at least one of the following: an ethyleniccarbon-carbon double bond, a carbon-carbon triple bond, an amino groupand/or a mercapto group. Whereas the carbon-carbon double bond andcarbon-carbon triple bond may be directly bonded to the silicon atom,neither the mercapto group nor the amino group may be directly bonded tothe silicon. Rather, the mercapto and amino groups are preferably bondedthrough a carbon linkage. Additionally, although more than one or acombination of amino and/or mercapto groups may be present in any oneorganic constituent bonded to the silicon atom, it is preferred thatonly one of such functional groups are present per organic constituent.Finally, the amino group may be either a primary or secondary amine andis preferably a primary amine.

Exemplary of the modifiers that may be used in the present inventionthere may be given gamma aminopropyl triethoxy silane,2-(3-cyclohexenyl)ethyl trimethoxy silane, 1,3-divinyl tetraethoxysilane, vinyl- tris-(2-methoxyethoxy)silane,5-(bicycloheptenyl)triethoxy silane and gamma mercaptopropyl trimethoxysilane.

The amount of the property improving silane derivate compound to be usedin the practice of the present invention is that amount which manifestsproperty improvement as compared to unmodified polyphenylene etherpolyamide compositions. Such property improvement is most evident inimproved compatibility as well as improved processability, impactstrength and/or elongation. In general, the amount of property improvingsilane derivative will be up to about 4%, preferably from about 0.05 toabout 2% by weight based on the total composition. The precise amount ofsilane derivative to achieve the optimum results is dependent upon suchfactors as the specific silane derivative chosen, the concentration ofeach ingredients to the composition and the mixing and/or processingconditions including temperature, shear, etc., which can easily bedetermined by routine experimentation.

In the practice of the present invention, it may be further desirable toadd rubbery high-molecular weight polymers to further improve thephysical properties, particularly impact strength, and/or processabilityof the composition. The rubbery high-molecular weight materials includenatural and synthetic polymeric materials showing elasticity at roomtemperature. More specifically, the rubbery high molecular weightmaterials include natural rubber, thermoplastic elastomers as well ashomopolymers and copolymers, including random, block and graftcopolymers, derived from various suitable monomers known to thoseskilled in the art including butadiene possibly in combination withvinyl aromatic compounds, especially styrene. As specific examples ofthe rubbery high-molecular weight materials, there may be given, forexample, natural rubber, butadiene polymers, styrene copolymers,butadiene/styrene copolymers, isoprene polymers, chlorobutadienepolymers, butadiene/acrylonitrile copolymers, isobutylene polymers,isobutylene/butadiene copolymers, isobutylene/isoprene copolymers,acrylic ester polymers, ethylene propylene copolymers,ethylene/propylene/diene copolymers, thiokol rubber, polysulfide rubber,polyurethane rubber, polyether rubber (e.g. polypropylene oxide) andepichlorohydric rubber.

A preferred class of rubber materials are copolymers, including random,block and graft copolymers of vinyl aromatic compounds and conjugateddienes. Exemplary of these materials there may be given hydrogenated,partially hydrogenated, or non-hydrogenated block copolymers of theA-B-A and A-B type wherein A is polystyrene and B is an elastomericdiene, e.g. polybutadiene, radial teleblock copolymer of styrene and a Yconjugated diene, acrylic resin modified styrene-butadiene resins andthe like; and graft copolymers obtained by graft-copolymerization of amonomer or monomer mix containing a styrenic compound as the maincomponent to a rubber-like polymer. The rubber-like polymer used in thegraft copolymer are as already described herein including polybutadiene,styrene-butadiene copolymer, acrylonitrile-butadiene copolymer,ethylene-propylene copolymer, polyacrylate and the like. The styreniccompounds includes styrene, methylstyrene, dimethylstyrene,isoproylstyrene, alpha-methylstyrene, ethylvinyltoluene and the like.The monomer which may be used together with the styrenic compoundincludes, for example, acrylate, methyacrylate, acrylonitrile,methyacrylonitrile, methyacrylic acid, acrylic acid and the like.

Finally, additional thermoplastic elastomers suitable for use as therubbery material include thermoplastic polyester elastomers,thermoplastic poly- ether-ester elastomers, ethylenic ionomer resins andthe like.

The amount of the rubbery polymer used will be up to about 100 parts byweight, preferably from about 5 to about 50 parts by weight based on 100parts by weight of a mixture of polyphenylene ether and polyamide.However, when the amount is less than 2 parts by weight, the effect ofthe rubbery polymer to improve impact resistance is poor. When theamount is more than 100 parts by weight, the impact resistance is muchimproved, however, some loss of other physical properties may result.Thus in the interest of balancing impact resistance and other physicalproperties, it is preferred to use less than 100 parts by weight of therubbery polymer.

The compositions of the present invention may also comprise similaramounts, as referred to above, of alkenyl aromatic compounds. Thesealkenyl aromatic compounds may or may not be partially or whollycopolymerized with and/or grafted to the polyphenylene ether.Especially, suitable are the styrene resins described in for exampleU.S. Pat. No. 3,383,435, incorporated herein by reference. In general,the styrene resins will have at least 25% by weight of the polymer unitsderived from a vinyl aromatic compound of the formula: ##STR3## whereinR¹ is hydrogen, (lower) alkyl or halogen, Z is vinyl, halogen or (lower)alkyl, and p is 0 or an integer of from 1 to the number of replaceablehydrogen atoms on the benzene nucleus. Herein, the term "(lower) alkyl"is intended to mean alkyl of from 1 to 6 carbon atoms.

The term "styrene resins" as used broadly throughout this disclosure andthe appended claims includes, by way of example, homopolymers such aspolystyrene and polychlorostyrene, as well as polystyrenes, includinghigh impact polystyrenes, which have been modified by a natural orsynthetic rubber, e.g. polybutadiene, polyisoprene, butyl rubber,ethylene-propylene diene copolymers (EPDM rubber), ethylene-propylenecopolymers, natural rubbers, polysulfide rubbers, polyurethane rubbers,styrene-butadiene rubbers (SBR), and the like; styrene containingcopolymers such as styrene-acrylonitrile copolymers (SAN),styrene-butadiene copolymers, styrene-acrylonitrile-butadieneterpolymers (ABS), poly-alpha-methylstyrene, copolymers of ethylvinylbenzene and divinylbenzene and the like.

Finally, in addition to the foregoing, the resin compositions of thepresent invention may further comprise other reinforcing additives,including glass fibers, carbon fibers, mineral fillers and the like aswell as various flame retardants, colorants, stabilizer and the likeknown to those skilled in the art.

The method for producing the resin compositions of the present inventionis not particularly limited, and the conventional methods aresatisfactorily employed. Generally, however, melt blending methods aredesirable. The time and temperature required for melt-blending are notparticularly limited, and they can properly be determined according tothe composition of the material. The temperature varies somewhat withthe blending ratio of the polyphenylene ether to polyamide, but it isgenerally within a range of 200° to 350° C. A prolonged time and/or ahigh shear rate is desirable for mixing, but the deterioration of theresin composition advances. Consequently, the time needs to bedetermined taking into account these points.

Any of the melt-blending methods may be used, if it can handle a moltenviscous mass. The method may be applied in either a batchwise form or acontinuous form. Specifically, extruders, Bambury mixers, rollers,kneaders and the like may be exemplified.

All ingredients may directly be added to the processing system or onepolymer, preferably the polyphenylene ether may be preblended with theproperty improving silane derivative prior to blending with thepolyamide. With respect to the other ingredients of the composition, allingredients may be added directly to the processing system or certainadditives may be precompounded with each other or either polymer priorto blending with the other polymer. For example, the polyphenylene ethermay be precompounded with the rubber polymer and/or the propertyimproving silane derivative and subsequently compounded with thepolyamide. In the foregoing discussion, all preblending may be eitherdry blending or melt blending and is preferably melt blending.

The following examples are presented in order that those skilled in theart may better understand how to practice the present invention. Theseexamples are merely presented by way of illustration and are not to beconstrued as limiting the invention thereto.

In the following examples the following abbreviations are used toidentify the respective silane compound:

GAP gamma aminopropyl triethoxy silane

CET 2-(3-cyclohexenyl)ethyl trimethoxy silane

DVT 1,3-divinyl tetraethoxy silane

VTS vinyl-tris-(2-methoxy ethoxy) silane

BCT 5-(bicycloheptenyl)triethoxy silane

GMP gamma mercaptopropyl trimethoxy silane

Examples E1 -E4, Comparative Examples CE1

A series of polyphenylene ether-polyamide compositions within andoutside of the scope of the present invention were prepared. Allcompositions were prepared on a single screw extruder by direct additionof ingredients and extruded at 300° C. The material was extruded,pelletized and injection molded to make test parts. The specificformulation (parts by weight) and the physical properties thereof areshown in Table I.

This first set of examples clearly demonstrate the improvement in impactstrength in the polyphenylene ether - polyamide blends by incorporatingtherein a silane derivative within the scope of the present invention.

                  TABLE I                                                         ______________________________________                                                     CE1   E1     E2      E3   E4                                     ______________________________________                                        Polyphenylene ether.sup.a                                                                    70      70     70    70   70                                   Polyamide 6,6.sup.b                                                                          30      30     30    30   30                                   GAP            --      0.5    --    --   --                                   DVT            --      --     0.5   --   --                                   VTS            --      --     --    0.5  --                                   GMP            --      --     --    --   1.5                                  Unnotched Izod ft.lb./in.                                                                    2.8     8.0    4.7   7.3  20.0                                 ______________________________________                                         .sup.a Poly(2,6dimethyl-1,4-phenylene)ether produced by General Electric      Company                                                                       .sup.b Polyamide 6,6 from duPont                                         

Examples E5-E8, Comparative Example CE2

A second series of examples were prepared as described above againdemonstrating the effectiveness of various silane derivatives inenhancing impact strength and tensile elongation of polyphenyleneether-polyamide compositions modified with a high molecular weightrubbery polymer. The formulations (in parts by weight) and properties ofeach were as set forth in Table II.

A review of Examples E5-E8 clearly demonstrates the improvement inimpact strength and tensile elongation as a result of the presence ofthe silane derivative as compared to the comparative Example CE2.

                  TABLE II                                                        ______________________________________                                                    CE2    E5     E6      E7   E8                                     ______________________________________                                        Polyphenylene ether.sup.a                                                                   49       49     49    49   49                                   Polyamide 6,6.sup.b                                                                         41       41     41    41   41                                   Kraton G.sup.c                                                                              10       10     10    10   10                                   CET           --       1.6    --    --   --                                   DVT           --       --     2.1   --   --                                   VTS           --       --     --    0.5  --                                   BCT           --       --     --    --   1.2                                  Notched Izod ft.lb./in.                                                                     0.4-0.9  1.9    2.0   1.5  2.5                                  Tensile Elongation %                                                                        3-8      23     33    17   36                                   ______________________________________                                         .sup.a&b See Table I                                                          .sup.c styrenehydrogenated-butadiene-styrene triblock copolymer from          Shell.                                                                   

Examples E9-E11

A third series of examples was prepared demonstrating the utility ofvarious levels of the silane derivative, gamma aminopropyl triethyoxysilane (GAP) in a rubber modified polyphenylene ether-polyamide blend.These examples were prepared as above. The formulations of the examples(in parts by weight) and the physical properties thereof were as shownin Table III.

These examples clearly demonstrate the utility of the silane derivativesat various levels of incorporation.

                  TABLE III                                                       ______________________________________                                                     CE2    E9      E10      E11                                      ______________________________________                                        Polyphenylene ether.sup.a                                                                    49       49      49     49                                     Polyamide 6,6.sup.b                                                                          41       41      41     41                                     Kraton G.sup.c 10       10      10     10                                     GAP            --       1.0     1.5    2.0                                    Notched Izod ft.lb./in.                                                                      0.4-0.9  1.9     1.6-3.3                                                                              --                                     Tensile Elongation %                                                                         3-8      34      20-33  25                                     ______________________________________                                         .sup.a,b&c See Table II above.                                           

Examples E12-E15, Comparative Examples CE3-CE6

A final series of examples was prepared demonstrating the applicabilityof the present invention to rubber modified polyphenyleneether-polyamide blends employing various polyamides and blends thereof.These examples were prepared as above. The formulations of theseexamples (in parts by weight) and the physical properties thereof wereas shown in Table IV.

Once again, comparison of these examples with their respectivenon-silane modified compositions clearly demonstrate the improved impactstrength and tensile elongation of the compositions of the presentinvention.

                                      TABLE IV                                    __________________________________________________________________________                 E12                                                                              CE3                                                                              E13                                                                              CE4                                                                              E14                                                                              CE5                                                                              E15                                                                              CE6                                         __________________________________________________________________________    Polyphenylene oxide.sup.a                                                                  49 49 49 49 49 49 22.5                                                                             22.5                                        Polyamide 6.sup.b                                                                          41 41 20.5                                                                             20.5                                                                             -- -- -- --                                          Polyamide 6,6.sup.c                                                                        -- -- 20.5                                                                             20.5                                                                             -- -- 67.5                                                                             67.5                                        Polyamide 4,6.sup.d                                                                        -- -- -- -- 41 41 -- --                                          Kraton G.sup.e                                                                             10 10 10 10 10 10 10 10                                          GAP          1.5                                                                              -- 1.5                                                                              -- 1.5                                                                              -- 1.5                                                                              --                                          Notched Izod ft.lb./in.                                                                    2.2                                                                              0.4                                                                              1.0                                                                              0.2                                                                              1.2                                                                              0.3                                                                              1.1                                                                              0.8                                         Tensile Elongation, %                                                                      52 4  31 2  13 2  31 22                                          __________________________________________________________________________     .sup.a See a in Table I above                                                 .sup.b Nylons 6 from Nylon Corporation of America                             .sup.c Nylons 6,6 from duPont                                                 .sup.d Nylons 4,6 from Dutch State Mines                                      .sup.e See note c. Table II                                              

Obviously, other modifications and variations of the present inventionare possible in light of the above teachings. It is, therefore, to beunderstood that changes may be made in the particular embodiments of theinvention described herein which are within the full intended scope ofthe invention as defined by the appended claims.

We claim:
 1. A resin composition consisting essentially of one or morepolyphenylene ethers, one or more polyamides and an effective amount ofa silane derivative compound for improving the tensile elongation of thecomposition, said silane derivative compound having in the molecule both(a) at least one silicon bonded to carbon through an oxygen link and (b)at least one ethylenic carbon-carbon double bond or carbon-carbon triplebond and/or functional group selected from the group consisting of anamine group or a mercapto group with the proviso that the functionalgroup is not directly bonded to a silicon atom, said polyphenylene etherbeing present in said composition in a weight ratio to said polyamide offrom between 95/5 and 49/41.
 2. A resin composition consisting of one ormore polyphenylene ethers, one or more polyamides and an effectiveamount of a silane derivative compound for improving the compatibilityof said polyamide with said polyphenylene ether, said silane derivativecompound having in the molecule both (a) at least one silicon bonded tocarbon through an oxygen link and (b) at least one ethyleniccarbon-carbon double bond or carbon-carbon triple bond and/or functionalgroup selected from the group consisting of an amine group or a mercaptogroup with the proviso that the functional group is not directly bondedto a silicon atom.
 3. A resin composition comprising:(a) at least onepoly(2,6-dimethyl-1,4-phenylene)-ether; (b) at least one polyamide 6,6;and (c) at least one silane compound selected from the group consistingof gamma aminopropyl triethoxy silane, 1,3-divinyl tetraethoxy silane,vinyl-tris-(2-methoxy ethoxy) silane and gamma mercaptopropyl trimethoxysilane, said poly (2,6-dimethyl-1,4-phenylene)ether being present insaid composition in a weight ratio to said polyamide 6,6 of from between95/5 and 70/30, said silane compound being present in said compositionat a level of from 0.05 percent to 4 percent by weight based on thetotal weight of the composition.
 4. The composition of claim 1 whereinsaid polyphenylene ether is present in said composition at a weightratio to said polyamide of from between 95/5 and 70/30.
 5. The resincomposition of claim 2 wherein the silane derivative is selected fromthe group consisting of gamma aminopropyl triethoxy silane;2-(3-cyclohexenyl)ethyl trimethoxy silane; 1,3-divinyl tetraethoxysilane; vinyl-tris -(2-methoxyethoxy)silane;5-(bicycloheptenyl)triethoxy silane and gamma mercaptopropyl trimethoxysilane.
 6. The resin composition of claim 2 wherein the amount of thesilane derivative compound is an amount up to about 4% by weight basedon the weight of the total composition.
 7. The resin composition ofclaim 6 wherein the amount of the silane derivative compound is anamount of from about 0.05 to about 2% by weight based on the weight ofthe total composition.
 8. The composition of claim 2 wherein thepolyphenylene ether is a homopolymer or a copolymer having units withthe repeating structural formula: ##STR4## wherein the oxygen ether atomof one unit is connected to the benzene nucleus of the next joiningunit, and n is a politive integer and is at least 50, and each Q isindependently a monovalent substituent selected from a group consistingof hydrogen, halogen, hydrocarbon and hydrocarbonoxy groups free of atertiary alpha-carbon atom and halohydrocarbon and halohydrocarbonoxygroups free of a tertiary alpha-carbon atom and having at least 2 carbonatoms between the halogen atom and the phenyl nucleus.
 9. Thecomposition of claim 2 wherein the polyamide is selected from the groupconsisting of polyamide 6; polyamide 6,6; polyamide 12; polyamide 6/10;polyamide 4/6; polyamide 6/I and mixtures thereof.
 10. The compositionof claim 9 wherein the polyamide is polyamide
 6. 11. The composition ofclaim 9 wherein the polyamide is polyamide 6/6.
 12. The composition ofclaim 9 wherein the polyamide is polyamide 4/6.
 13. The composition ofclaim 2 which further comprises not more than about 50% by weight basedon the total composition of a alkenyl aromatic polymer.
 14. A resincomposition as defined in claim 1 wherein said polyphenylene ether ispresent in said composition at a weight ratio to said polyamide of frombetween 95/5 and 70/30.
 15. A resin composition as defined in claim 1consisting essentially of:(a) at least onepoly(2,6-dimethyl-1,4-polyphenylene)ether; (b) at least one polyamide6,6; and (c) at least one silane compound selected from the groupconsisting of gamma aminopropyl triethoxy silane, 1,3-divinyltetraethoxy silane, vinyl-tris-(2-methoxy ethoxy) silane and gammamercaptopropyl trimethoxy silane, saidpoly(2,6-dimethyl-1,4-phenylene)ether being present in said compositionin a weight ratio to said polyamide 6,6 of from between 95/5 and 70/30,said silane compound being present in said composition at a level offrom 0.05 percent to 4 percent by weight based on the total weight ofthe composition.